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Endwave is constantly investing in new ideas and approaches that will improve our ability to meet demands for faster, cheaper, more efficient RF, microwave and millimeterwave components and subsystems. These technologies are "disruptive" in nature, break through traditional cost vs. performance barriers and bring significant competitive advantage to customers.
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MLMS™
MLMS is an advanced MMIC alternative technology that uses active flip-chip and EM coupling methods to minimize semiconductor real estate and RF wire-bonding. These MEMS-like substrates process with the ease of silicon and operate to 100 GHz. With MLMS we’re able to combine a variety of technologies, including SMT, chip-on-board, and bare chip-and-wire on a single printed circuit.
To learn more, visit our knowledge center.
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Epsilon Packaging™
To counter the high costs of conventional mechanical housings, covers, and other packaging complications, Endwave has developed Epsilon Packaging. This inline, metalized FR-4 and injection molded metalized plastics technology
eliminates the dependency on bulky machined or cast mechanical housings.
To learn more, visit our knowledge center or packageless transceivers.
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