Letting the Application Drive the Solution Microwave subsystem design is not a "one size fits all" process. With Endwave, you get options. Your application will be considered from all angles, and our solution will carefully weigh your frequency of operation, quantity, environmental conditions, and critical performance criteria. Whether your application requires an advanced hybrid MIC circuit, custom GaAs PHEMT or HBT MMIC, or a proprietary flip-chip design using MLMS™, we'll employ the best circuit technology for the job. Plus, we have the mechanical packaging know-how to combine a variety of assembly processes-from SMT, to bare chip-and-wire, to our proprietary chip-on-board Epsilon™ Packaging, in order to create perfectly integrated modules that fit seamlessly into your system architecture.

Design Library from 1 to 100 GHz Endwave's designs are based on a proprietary library of circuit design cells, or "building blocks". The use of this IC and module design library permits rapid design and prototype of new RF subsystems: Custom MMIC Designs JCA Amplifiers™ (LNAs, PAs, Limiting Amps, Low Phase Noise Amps) Passive Components (Filters, Combiners, Couplers, Bias Networks) YIG and VCO-based Oscillators and Synthesizers Phase Shifters, Detectors and Limiters Switches and Complex Switch Arrays Frequency Multipliers and Mixers Up/Down-Converters T/R Modules & Integrated Transceivers Other Custom Multi-Function Assemblies (MFAs)

Depth and Breadth of Technical Expertise Endwave's technical team has broad expertise in semiconductor device physics, microwave circuit and module design, firmware and software development, mechanical packaging, system engineering, test engineering and other critical disciplines. We have a keen understanding of how our module behavior impacts overall system performance, and conversely how system level requirements flow down to those imposed upon our products. When collaborating with your engineering teams on new product design, we'll communicate vital cost vs. performance tradeoffs that will help guide your overall development strategy.

The Right Tools and Processes for the Job Our engineering teams, in both east and west coast design centers, develop high-frequency modules and subsystems to meet customer-specific requirements for cost, performance, and mechanical outline. Endwave engineers use the latest computer simulation and CAD tools to predict subtle but critical performance differences amongst various design options. As a result, we avoid the "cut and try" approach that characterizes much of the high-frequency industry. The use of automated test kits allows for thorough and rapid characterization of new designs. This, along with employing strict Design for Manufacturability (DFM) techniques in our development procedures, ensures a smooth handoff from prototyping to production. Electrical Design Tools: HFSS™, IE3D™, Microwave Office™, ADS™, Eagleware™ Mechanical Design Tools: SolidWorks™, Cosmos™, Allegro™, EPD™ and AutoCad™ Test Software: HP Vee™, LabView™