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Endwave is Leading the Way in Microwave Innovation
Endwave has earned a reputation as the technology leader in each of the markets we serve. With 42 issued patents covering our core technologies, including semiconductor and proprietary circuit designs, the Endwave team possesses the critical know-how to develop leading edge subsystems for you.
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Today's Circuit Technology
In high-frequency RF modules, the choice and implementation of the basic circuit technology determine the performance, cost and manufacturability of the product. Currently, most of our products employ one of two alternate technologies, either hybrid microwave integrated circuit (HMIC) technology or monolithic microwave integrated circuit (MMIC) technology. In each case, we apply our circuit design capabilities to develop custom circuits that are optimized for cost, performance and manufacturability. We have advanced the design of our HMIC and MMIC circuits significantly and have benefited from those advancements in reduced costs and higher production yields. Our ability to design custom semiconductors, yet remain fabless, allows us to optimize and reduce the cost of designs beyond what is possible with standard, off-the-shelf semiconductors.
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Tomorrow's "Disruptive" Technologies
We are constantly investing in new ideas and approaches that will improve our ability to meet demands for faster, cheaper, more efficient products. These technologies are “disruptive” in nature, breaking through traditional cost vs. performance barriers and bringing significant competitive advantage to those who take advantage of the technology. These are just a few of our more recent innovations that are being introduced in Endwave products today.
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MLMS™ is an advanced circuit technology that uses active flip-chip and EM coupling methods to minimize semiconductor real estate and RF wire-bonding. In MLMS we've moved passive circuitry onto an inexpensive MEMS-like substrate that processes with the ease of silicon, but works to 100 GHz. Further innovation has allowed us to combine a variety of technologies, including SMT, chip-on-board, and bare chip-and-wire, into perfectly integrated modules that fit seamlessly into your system architecture.
Learn more about MLMS
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